Introduction
With two processors installed, the two processors are connected together using one UPI link. With four processors installed, the processors are connected together using a ring topology, using two UPI links, one to each adjacent processor in the ring.
Processors with the T suffix have more robust thermal characteristics (higher T-case). Processors with the M suffix support support greater than 768 GB per processor.
Processor
Processor generation
1st Generation IntelŽ XeonŽ Scalable
Processor model
6128
Processor base frequency
3.4 GHz
Processor family
IntelŽ XeonŽ Gold
Processor cores
6
Processor socket
LGA 3647 (Socket P)
Component for
Server/workstation
Processor lithography
14 nm
Processor threads
12
Processor operating modes
64-bit
Processor boost frequency
3.7 GHz
Processor cache
19.25 MB
Processor cache type
L3
Thermal Design Power (TDP)
115 W
Cooler included
Y
Stepping
H0
Processor codename
Skylake
Memory
Maximum internal memory supported by processor
768 GB
Memory types supported by processor
DDR4-SDRAM
Memory clock speeds supported by processor
2666 MHz
Memory channels
Hexa-channel
ECC
Y
Graphics
On-board graphics card
N
Features
Execute Disable Bit
Y
Market segment
Server
Maximum number of PCI Express lanes
48
PCI Express slots version
3.0
Scalability
S4S
Embedded options available
N
Processor special features
IntelŽ Hyper Threading Technology (IntelŽ HT Technology)
Y
IntelŽ Turbo Boost Technology
2.0
IntelŽ AES New Instructions (IntelŽ AES-NI)
Y
Enhanced Intel SpeedStep Technology
Y
Intel Trusted Execution Technology
Y
IntelŽ Speed Shift Technology
Y
Intel VT-x with Extended Page Tables (EPT)
Y
Intel TSX-NI
Y
Intel 64
Y
Intel Virtualization Technology (VT-x)
Y
Intel Virtualization Technology for Directed I/O (VT-d)
Y
Conflict-Free processor
Y
Intel Turbo Boost Max Technology 3.0
N
IntelŽ Optane Memory Ready
N
IntelŽ vPro Platform Eligibility
Y
Operational conditions
Tcase
74 °C